JPH0566037B2 - - Google Patents
Info
- Publication number
- JPH0566037B2 JPH0566037B2 JP57051155A JP5115582A JPH0566037B2 JP H0566037 B2 JPH0566037 B2 JP H0566037B2 JP 57051155 A JP57051155 A JP 57051155A JP 5115582 A JP5115582 A JP 5115582A JP H0566037 B2 JPH0566037 B2 JP H0566037B2
- Authority
- JP
- Japan
- Prior art keywords
- metal
- electrical
- electrical connection
- melting point
- connection device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Multi-Conductor Connections (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57051155A JPS58169996A (ja) | 1982-03-31 | 1982-03-31 | 電気的接続装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57051155A JPS58169996A (ja) | 1982-03-31 | 1982-03-31 | 電気的接続装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58169996A JPS58169996A (ja) | 1983-10-06 |
JPH0566037B2 true JPH0566037B2 (en]) | 1993-09-20 |
Family
ID=12878931
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57051155A Granted JPS58169996A (ja) | 1982-03-31 | 1982-03-31 | 電気的接続装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58169996A (en]) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61195085U (en]) * | 1985-05-27 | 1986-12-04 | ||
JPS6340272A (ja) * | 1986-08-04 | 1988-02-20 | 富士通株式会社 | 電気的相互接続装置 |
JP2001093596A (ja) * | 1999-09-28 | 2001-04-06 | Nec Kansai Ltd | 気密端子 |
HU225976B1 (en) * | 2004-02-16 | 2008-02-28 | Andras Fazakas | Brazing seat for guiding rail |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5659480A (en) * | 1979-10-22 | 1981-05-22 | Hitachi Ltd | Method of connecting part and connector used therefor |
JPS5720500A (en) * | 1980-07-11 | 1982-02-02 | Nippon Telegraph & Telephone | Electronic circuit module |
-
1982
- 1982-03-31 JP JP57051155A patent/JPS58169996A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS58169996A (ja) | 1983-10-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0265077A2 (en) | An anisotropic adhesive for bonding electrical components | |
JP5236379B2 (ja) | Ic検査装置用基板及びその製造方法 | |
US3561110A (en) | Method of making connections and conductive paths | |
US4942140A (en) | Method of packaging semiconductor device | |
US5683566A (en) | Method of manufacting an SMD resistor | |
US5873161A (en) | Method of making a Z axis interconnect circuit | |
EP0280700A1 (en) | METHOD AND APPARATUS FOR FIXING A CIRCUIT MODULE. | |
JPH077038A (ja) | 電子パッケージ | |
KR20010091898A (ko) | 반도체 칩 패키지 | |
EP0544305A2 (en) | Method of forming a contact bump using a composite film | |
JPH0566037B2 (en]) | ||
JP3930222B2 (ja) | 半導体装置の製造方法 | |
KR20120050834A (ko) | 반도체 패키지 기판의 제조방법 | |
JP5292827B2 (ja) | 半導体装置の製造方法及び半導体装置の製造装置 | |
JP2538542B2 (ja) | 電気的接続装置 | |
JPS59205170A (ja) | 電気的接続装置 | |
JP2010028028A (ja) | 多層プリント配線板とその製造方法 | |
JP2007173342A (ja) | 基板実装構造、その実装方法およびそれに使用される整列板の構造 | |
EP0610631A1 (en) | Electrical connector | |
US7083901B2 (en) | Joining member for Z-interconnect in electronic devices without conductive paste | |
JPH0430200B2 (en]) | ||
CN111385981B (zh) | 多样化装配印刷线路板及制造方法 | |
JPH0318742B2 (en]) | ||
US20150366058A1 (en) | Wiring substrate and method for producing the same | |
JP2019160851A (ja) | 配線基板およびその製造方法 |